Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 431 items
Outstanding cooling effect!
Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.
Achieves high cooling performance due to being made of copper.
Air-cooled heat sink
Cooling can be performed in combination with air-cooled or water-cooled heat sinks.
Heat pipe for transferring heat
3 mm thickness by P-B bonding
Thin water cooling plate
Outstanding cooling performance
Stacked water-cooled plate
Immediate delivery is possible for in-stock items! We have a range of standard products available from 20mm square to 1m long, suitable for various applications.
We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. As these are in stock, we can deliver them immediately, and we also sell peripheral equipment such as cooling water circulation devices. Additionally, we are open to inquiries for custom products. 【Features】 ■ Exceptional cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery available for in-stock items ■ Peripheral equipment such as cooling water circulation devices also for sale ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.
Made of oxygen-free copper with excellent thermal conductivity and durability! In addition to 8 types of standard products, we can also manufacture various custom products according to your needs.
In recent years, the demand for UV-LED has significantly expanded. We would like to introduce the "water-cooled heat sink" that maximizes its performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. In addition to eight standard types compatible with various manufacturers' LEDs, custom production is available up to approximately 500×800 millimeters. We also offer processing such as tapping, notching, surface treatment, and helicoil installation upon request. Please feel free to contact us. 【Features】 ■ Made of oxygen-free copper, excellent in thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to eight standard types, various custom products can be manufactured according to application ■ Socket types include pipe, bamboo shoot type, PT thread, and nut fastening ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.
Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments such as 1U rack-mounted servers that have blower fans installed or small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.
Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.
Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the operating environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.
Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.
Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To achieve cooling, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink made from a single piece of aluminum ingot (raw material state) that has been machined (skyve processed).
WKBS Forced Air Cooling Dedicated Heat Sink
This is a dual-sided riveted type heat sink that applies the conventional single-sided riveting method (KBS) series. ● It is a high-performance heat sink specifically designed for forced air cooling, capable of both single-sided and dual-sided mounting. ● It features an optimal structural design for mounting various modules such as Tr, DI, and IGBT. ● Compared to conventional products, the upper and lower fins are fixed, eliminating the need for fin retaining plates, so no side mounting screws are required. ● It prevents fin vibration. ● Even in the single-sided mounting type, component mounting is possible on the backside.
The optimal heat sink requires a balance between thermal expansion rate and conductivity.
Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.
